|Minimum component size||0201 housing, 0,6 * 0,3 mm|
|Maximum component size||56 * 56 mm|
|Maximum component height||15 mm|
|Housing types||SOIC, PLCC, TSOP, QFP, BGA, QFN, DFN, odd-shaped, surface-mount|
|Through-hole components||Connectors, DPAK, Alcap, Tantalum|
There are no restrictions as to the placement of components. The vapour phase soldering technique does not create 'shadows'. Small components may be placed under or in close proximity to larger components.
Larger components requiring special handling may be soldered using the selective soldering method.
There are no restrictions as to the placement of components. Small components requiring a small amount of solder paste may be placed i close proximity to larger components requiring a larger amount of solder paste.
Leaded componens - connectors, socets etc. - does not require special handliing, the solder paste printer calculates the extra amount of soder paste needed to make a perfect soldering result.
There are generally no restrictions as to the placement of components.
If double sided placement is used, no component on the side first mounted must protrude more than 20 mm from the PCB.